Future Innovations

Photonic chip packaging can withstand extreme environments

Researchers at the National Institute of Standards and Technology (NIST) have developed a new way to package photonic integrated circuits—tiny chips that convey information using light instead of electricity—so they can survive and operate in […]

Future Innovations

AI-based model measures atomic defects in materials

In biology, defects are generally bad. But in materials science, defects can be intentionally tuned to give materials useful new properties. Today, atomic-scale defects are carefully introduced during the manufacturing process of products like steel, […]